发明授权
- 专利标题: Substrate transfer system for semiconductor processing equipment
- 专利标题(中): 半导体加工设备基板转移系统
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申请号: US09193991申请日: 1998-11-17
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公开(公告)号: US06293749B1公开(公告)日: 2001-09-25
- 发明人: Ivo Raaijmakers , Loren R. Jacobs , Michael W. Halpin , James A. Alexander , Ken O'Neill , Dennis L. Goodwin
- 申请人: Ivo Raaijmakers , Loren R. Jacobs , Michael W. Halpin , James A. Alexander , Ken O'Neill , Dennis L. Goodwin
- 主分类号: B65G4907
- IPC分类号: B65G4907
摘要:
A system for facilitating wafer transfer comprises a susceptor unit consisting of an inner susceptor section which rests within an outer susceptor section. A vertically movable and rotatable support spider located beneath the susceptor unit can rotate into positions to engage either the inner or the outer susceptor sections. When the inner section is engaged, the support spider lifts the inner section vertically out of the outer section. When the outer section is engaged, the support spider raises and lowers the entire susceptor unit. A robotic arm end effector engaging only the lower surface of the outer edge of the wafer permits hot wafer pick-up and unloading by the inner susceptor section. Several end effectors are disclosed that minimize non-uniform thermal effect on the substrate.