A seed package handling system is provided for a test plot combine. A seed packaging assembly in the combine packages the seeds and deposits the packages onto a conveyor, which transports the packages to a first hopper. After the first hopper has received a predetermined quantity or weight of seed, the first hopper is raised on an elevator and then tilted so as to dump the seed packages into a larger second hopper. After the second hopper has received a predetermined quantity or weight of seed, the second hopper is tilted to discharge the seed packages into a wagon separate from the combine, which transports the seed packages to a processing facility. The movement of the conveyor and first hopper is controlled by a PLC.