发明授权
US06294480B1 Method for forming an L-shaped spacer with a disposable organic top coating
有权
用一次性有机顶涂层形成L形间隔物的方法
- 专利标题: Method for forming an L-shaped spacer with a disposable organic top coating
- 专利标题(中): 用一次性有机顶涂层形成L形间隔物的方法
-
申请号: US09443427申请日: 1999-11-19
-
公开(公告)号: US06294480B1公开(公告)日: 2001-09-25
- 发明人: Yelehanka Ramachandramurthy Pradeep , Jie Yu , Minghui Fan , Chiew Wah Yap
- 申请人: Yelehanka Ramachandramurthy Pradeep , Jie Yu , Minghui Fan , Chiew Wah Yap
- 主分类号: H01L2131
- IPC分类号: H01L2131
摘要:
A method for forming an L-shaped spacer using a sacrificial organic top coating. A semiconductor structure is provided having a gate structure thereon. A liner oxide layer is formed on the gate structure. A dielectric spacer layer is formed on the liner oxide layer. In the preferred embodiment, the dielectric spacer layer comprises a silicon nitride layer or a silicon oxynitride layer. A sacrificial organic layer is formed on the dielectric spacer layer. The sacrificial organic layer and the dielectric spacer layer are anisotropically etched to form spacers comprising a triangle-shaped sacrificial organic structure and an L-shaped dielectric spacer. The triangle-shaped sacrificial organic structure is removed leaving an L-shaped dielectric spacer.
信息查询