A semiconductor memory device for a package-state voltage test has a plurality of bonding pads that are electrically connected to an external device in a package state, at least one internal DC voltage generator, at least one switch connected between one of the bonding pads and the internal DC voltage generator. The switch is on during a test mode and is off during a normal mode. The switch controller is connected between at least two of the plurality of bonding pads and serves to control the switch in response to an external switching signal in the test mode. Because of this design, a number of DC voltage tests can be performed without increasing chip size since a general control pad also serves as a DC voltage test pad.