An embodiment of a thermal drop detector in accordance with the present invention includes an array configured to define a plurality of cells each of which is configured to detect thermal changes in an area of that cell resulting from deposition of a drop adjacent that cell. This embodiment of a thermal drop detector additionally includes a thermally conductive layer over each of the cells to protect each of the cells from physical contact with the drop. A method of thermal drop detection in accordance with the present invention includes depositing a drop on a thermally conductive material, the thermally conductive material overlaying a thermally sensitive array. The method additionally includes measuring via the thermally sensitive array a thermal change resulting from deposition of the drop on the thermally conductive material. The method further includes determining a characteristic of the drop deposited on the thermally conductive material based upon the thermal change measured by the thermally sensitive array. Further characteristics and features of the thermal drop detector and method of thermal drop detection are described herein, as are various exemplary alternative embodiments.