发明授权
- 专利标题： Polishing slurry
- 专利标题（中）： 抛光浆
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申请号： US09484242申请日： 2000-01-18
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公开(公告)号： US06299795B1公开(公告)日： 2001-10-09
- 发明人: Lei Liu , Doris Kwok
- 申请人： Lei Liu , Doris Kwok
- 主分类号： C09K314
- IPC分类号： C09K314
摘要：
The polishing slurry includes polishing particles having a mean particle diameter of less than about 5 &mgr;m. The slurry contains at least about 0.5 weight percent oxidizer selected from at least one of the group consisting of HNO3, Ni(NO3)2, Al(NO3)3, Mg(NO3)2, Zn(NO3)2 and NH4NO3. A small but effective amount of a co-oxidizer selected from the group consisting of perbromates, perchlorates, periodates, persulfates, permanganates and ferric nitrate accelerates removal of substrates; and water forms the balance of the aqueous slurry.
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