A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.