发明授权
- 专利标题： Polyimide precursor, polyimide and their use
- 专利标题（中）： 聚酰亚胺前体，聚酰亚胺及其用途
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申请号： US09634582申请日： 2000-08-08
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公开(公告)号： US06309791B1公开(公告)日： 2001-10-30
- 发明人: Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
- 申请人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
- 优先权： JP7-088059 19950413
- 主分类号： G03F7075
- IPC分类号： G03F7075
摘要：
A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
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