发明授权
- 专利标题： Electric circuit and package for semiconductor
- 专利标题（中）： 半导体电路和封装
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申请号： US09412593申请日： 1999-10-05
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公开(公告)号： US06310393B1公开(公告)日： 2001-10-30
- 发明人: Tetsuyosi Ogura , Yukihiro Fukumoto , Hideki Iwaki , Yutaka Taguchi , Yoshihiro Bessho
- 申请人： Tetsuyosi Ogura , Yukihiro Fukumoto , Hideki Iwaki , Yutaka Taguchi , Yoshihiro Bessho
- 优先权： JP10-288259 19981009
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
The semiconductor package of this invention includes: a semiconductor element having a power supply terminal, a ground terminal, and an output terminal; an inductance; and a capacitance. One of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element, and the other terminal is connected to the ground terminal of the semiconductor element. The ground terminal of the semiconductor element is connected to a ground terminal of the semiconductor package, the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package via the inductance, and the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.
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