发明授权
- 专利标题： Surface acoustic wave device
- 专利标题（中）： 表面声波装置
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申请号： US09533666申请日： 2000-03-23
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公开(公告)号： US06310423B1公开(公告)日： 2001-10-30
- 发明人: Naoki Tanaka , Morio Ogura
- 申请人： Naoki Tanaka , Morio Ogura
- 优先权： JP11-081456 19990325
- 主分类号： H01L41107
- IPC分类号： H01L41107
摘要：
An SAW device includes a glass substrate, an LiNbO3 (LN) substrate, and an electrode. When a pitch of the electrode is &lgr;, a thickness of the LN substrate is H, and K equals to 2&pgr;/&lgr;, a product of K and H is at least 0.5 and at most 1.0. Accordingly, an SAW device is obtained which is provided with high K2 and an enhanced temperature characteristic and which can be advantageously reduced in size.
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