发明授权
- 专利标题: Surface acoustic wave device
- 专利标题(中): 表面声波装置
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申请号: US09533667申请日: 2000-03-23
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公开(公告)号: US06310424B1公开(公告)日: 2001-10-30
- 发明人: Morio Ogura , Naoki Tanaka
- 申请人: Morio Ogura , Naoki Tanaka
- 优先权: JP11-081650 19990325
- 主分类号: H01L4104
- IPC分类号: H01L4104
摘要:
An SAW device including a glass substrate, an LiNbO3 (LT) substrate, and an electrode. When a pitch of the electrode is &lgr;, a thickness of the LT substrate is H, and K equals to 2&pgr;/&lgr;, a product of K and H is at least 0.5 and at most 1.5. Accordingly, a SAW device which can advantageously reduced in size by a reduction in propagation velocity and which is provided with high K2 and an enhanced temperature characteristic as having a good temperature characteristic of the LT substrate.
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