发明授权
US06311023B1 Camera having a light-shieldable member for protecting a semiconductor element flip-chip-bonded on a flexible printed board
有权
相机具有用于保护倒装芯片粘结在柔性印刷电路板上的半导体元件的可遮光部件
- 专利标题： Camera having a light-shieldable member for protecting a semiconductor element flip-chip-bonded on a flexible printed board
- 专利标题（中）： 相机具有用于保护倒装芯片粘结在柔性印刷电路板上的半导体元件的可遮光部件
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申请号： US09198937申请日： 1998-11-24
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公开(公告)号： US06311023B1公开(公告)日： 2001-10-30
- 发明人: Akira Watanabe
- 申请人： Akira Watanabe
- 优先权： JP9-333218 19971203
- 主分类号： G03B1700
- IPC分类号： G03B1700
摘要：
A camera having a flexible printed board on which a semiconductor element is flip-chip-bonded, a light-shieldable member such as a housing, a lens barrel, or an outer member. An element formation surface of a semiconductor element flip-chip-bonded on the flexible printed board is arranged to oppose the light-shieldable member.
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