发明授权
- 专利标题： Thermoelectric semiconductor material, thermoelectric element, method of manufacturing these and method of manufacturing thermoelectric module and device for manufacturing thermoelectric semiconductor material
- 专利标题（中）： 热电半导体材料，热电元件，这些的制造方法和制造热电模块的方法以及制造热电半导体材料的装置
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申请号： US09414509申请日： 1999-10-08
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公开(公告)号： US06313392B1公开(公告)日： 2001-11-06
- 发明人: Yasunori Sato , Katsushi Fukuda , Keisuke Ikeda , Kenichi Tomita , Takeshi Kajihara , Akio Konishi , Kiyoharu Sasaki
- 申请人： Yasunori Sato , Katsushi Fukuda , Keisuke Ikeda , Kenichi Tomita , Takeshi Kajihara , Akio Konishi , Kiyoharu Sasaki
- 优先权： JP10-304757 19981012; JP11-168390 19990615
- 主分类号： H01L3534
- IPC分类号： H01L3534
摘要：
Powder of a semiconductor material and solvent are packed into a rubber tube and both ends of the rubber tube are fixed by fixing rings in a condition with sealing in the vertical direction effected by an upper cover and a lower cover. After this, the rubber tube is immersed in an oil bath and pressure is applied uniformly from the side faces to the semiconductor material within the rubber tube, using hydraulic pressure. An extrusion molding of rectangular shape and of smaller cross sectional area than before molding is formed by extrusion from an extrusion port of rectangular solid shape of a die (extrusion mold) in which pressure is applied in an extrusion direction D by a punch to a rectangular solid sintered body of thermoelectric semiconductor material.