发明授权
- 专利标题： Lead-free solder alloy
- 专利标题（中）： 无铅焊料合金
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申请号： US09771939申请日： 2001-01-30
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公开(公告)号： US06319461B1公开(公告)日： 2001-11-20
- 发明人: Shinjiro Domi , Koichi Sakaguchi , Shigeki Nakagaki , Katsuaki Suganuma
- 申请人： Shinjiro Domi , Koichi Sakaguchi , Shigeki Nakagaki , Katsuaki Suganuma
- 优先权： JPH11-164737 19990611
- 主分类号： B23K3526
- IPC分类号： B23K3526
摘要：
A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.