发明授权
- 专利标题： Printed circuit board
- 专利标题（中）： 印刷电路板
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申请号： US09337407申请日： 1999-06-21
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公开(公告)号： US06326694B1公开(公告)日： 2001-12-04
- 发明人: Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
- 申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
- 优先权： JP5-236220 19930922; JP5-262175 19931020
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
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