Semiconductor wafer and semiconductor device

发明授权

US06329700B1 Semiconductor wafer and semiconductor device 有权

标题翻译：半导体晶圆和半导体器件

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专利标题： Semiconductor wafer and semiconductor device
专利标题（中）： 半导体晶圆和半导体器件
申请号： US09253041

申请日： 1999-02-19
公开(公告)号： US06329700B1

公开(公告)日： 2001-12-11
发明人: Youichi Ishimura , Hideki Takahashi , Norihisa Asano
申请人： Youichi Ishimura , Hideki Takahashi , Norihisa Asano
优先权： JP10-290484 19981013
主分类号： H01L23544
IPC分类号： H01L23544

Semiconductor wafer and semiconductor device

摘要：

A semiconductor wafer and a semiconductor device with more chips are obtained. The semiconductor wafer includes a plurality of dicing lines (DXa, DXb, DYa, DYb) extending in the lateral direction (X) and in the longitudinal direction (Y) with an interval (L1) therebetween, and a semiconductor element forming region (CR1) with a semiconductor element, sectioned by the dicing lines (DXa, DXb, DYa, DYb). The dicing lines both in the lateral direction (X) and in the longitudinal direction (Y) have alternate widths (La, Lb), one of which (Lb) is larger than the other (La).

摘要（中）：

获得具有更多芯片的半导体晶片和半导体器件。半导体晶片包括沿横向（X）和纵向方向（Y）以它们之间的间隔（L1）延伸的多个切割线（DXa，DXb，DYa，DYb）和半导体元件形成区域（CR1 ）具有由切割线（DXa，DXb，DYa，DYb）分割的半导体元件。在横向（X）和纵向（Y）上的切割线都具有交替的宽度（La，Lb），其中一个（Lb）大于另一个（La）。

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