发明授权
US06329713B1 Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
有权
集成电路芯片载体组件，其包括附着到电介质基板的加强件
- 专利标题： Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
- 专利标题（中）： 集成电路芯片载体组件，其包括附着到电介质基板的加强件
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申请号： US09176654申请日： 1998-10-21
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公开(公告)号： US06329713B1公开(公告)日： 2001-12-11
- 发明人: Donald Seton Farquhar , Lisa Jeanine Jimarez , Michael Joseph Klodowski , Jeffrey Alan Zimmerman
- 申请人： Donald Seton Farquhar , Lisa Jeanine Jimarez , Michael Joseph Klodowski , Jeffrey Alan Zimmerman
- 主分类号： H01L2308
- IPC分类号： H01L2308
摘要：
An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.