发明授权
- 专利标题： Polyimide film and process for producing the same
- 专利标题（中）： 聚酰亚胺膜及其制造方法
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申请号： US09530102申请日： 2000-04-25
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公开(公告)号： US06335416B1公开(公告)日： 2002-01-01
- 发明人: Hitoshi Nojiri , Koichiro Tanaka
- 申请人： Hitoshi Nojiri , Koichiro Tanaka
- 优先权： JP10-238049 19980825; JP11-108698 19990416
- 主分类号： C08G7310
- IPC分类号： C08G7310
摘要：
A polyimide film, which is produced from polyamide acid prepared through the reaction of p-phenylenebis(trimellitic acid monoester anhydride), oxydiphthalic acid dianhydride, p-phenylenediamine, and 4,4′-diaminodiphenylether in an organic solvent, and which has a high elastic modulus, a high elongation, a low coefficient of linear expansion which is not quite different from that of copper, and a low coefficient of hygroscopic expansion.