发明授权
US06339337B1 Method for inspecting semiconductor chip bonding pads using infrared rays
失效
使用红外线检查半导体芯片接合焊盘的方法
- 专利标题： Method for inspecting semiconductor chip bonding pads using infrared rays
- 专利标题（中）： 使用红外线检查半导体芯片接合焊盘的方法
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申请号： US09048045申请日： 1998-03-26
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公开(公告)号： US06339337B1公开(公告)日： 2002-01-15
- 发明人: Shuichi Matsuda , Keiichiro Kata , Ryoji Sato , Masaharu Sato
- 申请人： Shuichi Matsuda , Keiichiro Kata , Ryoji Sato , Masaharu Sato
- 优先权： JP9-091342 19970327
- 主分类号： G01R3102
- IPC分类号： G01R3102
摘要：
An infrared ray test for a semiconductor chip is conducted by irradiating infrared ray onto a bottom surface of a semiconductor chip, receiving the infrared ray reflected from a bonding pad and displaying the image of the bonding pad on a monitor. The image obtained from the infrared ray has information whether the bonding pad itself or a portion of the silicon substrate underlying the bonding pad has a defect or whether or not there is a deviation of the bonding pad with respect to the bump.