发明授权
US06341845B1 Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
有权
用于宽阵列喷墨打印头组件的电气连接，具有用于打印头芯片的混合载体
- 专利标题： Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
- 专利标题（中）： 用于宽阵列喷墨打印头组件的电气连接，具有用于打印头芯片的混合载体
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申请号： US09648120申请日： 2000-08-25
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公开(公告)号： US06341845B1公开(公告)日： 2002-01-29
- 发明人: Joseph E. Scheffelin , Janis Horvath , Brian J. Keefe , Lawrence H. White , Ali Emamjomeh , Paul Mark Haines
- 申请人： Joseph E. Scheffelin , Janis Horvath , Brian J. Keefe , Lawrence H. White , Ali Emamjomeh , Paul Mark Haines
- 主分类号： B41J2155
- IPC分类号： B41J2155
摘要：
A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.
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