A backing plate 1 for sputtering is constituted by a base portion 2 comprising a plate member made of aluminum or its alloy, a surface of which is attached with a target T of an ITO sintered body or the like and a cooling portion 3 in a flat plate shape having a cooling medium flow path 6 at an inner portion thereof. Further, the cooling portion 3 is integrally attached to a rear face of the base 2 by friction agitation bonding. The cooling portion 3 comprises a roll bond panel 4 made of aluminum or its alloy and inner hollow portions of bulged pipe portions 5 constitute the cooling medium flow path 6. Thereby, a backing plate which is light-weighted and has high cooling efficiency can be provided.