发明授权
US06344675B1 SOI-MOS field effect transistor with improved source/drain structure and method of forming the same 失效
具有改善的源极/漏极结构的SOI-MOS场效应晶体管及其形成方法

  • 专利标题: SOI-MOS field effect transistor with improved source/drain structure and method of forming the same
  • 专利标题(中): 具有改善的源极/漏极结构的SOI-MOS场效应晶体管及其形成方法
  • 申请号: US09591506
    申请日: 2000-06-12
  • 公开(公告)号: US06344675B1
    公开(公告)日: 2002-02-05
  • 发明人: Kiyotaka Imai
  • 申请人: Kiyotaka Imai
  • 优先权: JP9-072913 19970326
  • 主分类号: H01L2900
  • IPC分类号: H01L2900
SOI-MOS field effect transistor with improved source/drain structure and method of forming the same
摘要:
The present invention provides a source/drain structure formed in a semiconductor layer which has source and drain regions of a first conductivity type and a body portion of a second conductivity type disposed between said source and drain regions. The body portion is positioned under a gate insulation film over which a gate electrode is provided. The source region has a first low resistive region which is lower in electrical resistivity than said source region and said drain region having a second low resistive region which is lower in electrical resistively than said source region. For the first present invention, it is important that a distance of an inside edge portion of the first low resistive region from a first interface between the source region and the body portion is shorter than a distance of an inside portion of the second low resistive region from a second interface between the drain region and the body portion.
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