发明授权
- 专利标题： Semiconductor device and method of forming the same
- 专利标题（中）： 半导体器件及其形成方法
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申请号： US09185716申请日： 1998-11-04
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公开(公告)号： US06347037B2公开(公告)日： 2002-02-12
- 发明人: Makoto Iijima , Tetsushi Wakabayashi , Toshio Hamano , Masaharu Minamizawa , Masashi Takenaka , Taturou Yamashita , Masataka Mizukoshi , Masaru Nukiwa , Takao Akai
- 申请人： Makoto Iijima , Tetsushi Wakabayashi , Toshio Hamano , Masaharu Minamizawa , Masashi Takenaka , Taturou Yamashita , Masataka Mizukoshi , Masaru Nukiwa , Takao Akai
- 优先权： JP6-092155 19940428; JP7-059562 19950317; JP10-083882 19980330
- 主分类号： H05H720
- IPC分类号： H05H720
摘要：
A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.
公开/授权文献
- US20020001178A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME. 公开/授权日：2002-01-03
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