发明授权
- 专利标题： Electronic chip packaging
- 专利标题（中）： 电子芯片包装
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申请号： US09244300申请日： 1999-02-03
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公开(公告)号： US06349032B1公开(公告)日： 2002-02-19
- 发明人: Benson Chan , Richard R. Hall , John H. Sherman , Candido C. Tiberia
- 申请人： Benson Chan , Richard R. Hall , John H. Sherman , Candido C. Tiberia
- 主分类号： H05K720
- IPC分类号： H05K720
摘要：
An electronic package contains a circuit card to which a chip carrier plate is attached via solder balls. A heat spreader plate, supporting a heat sink, is spring loaded against the semiconductor chip of the carrier plate by means of elastomeric disks disposed upon a spring retainer plate that is, itself, disposed adjacent the chip carrier plate. A plastic cover both protects and supports the heat sink and semiconductor chip. A retention latch is disposed between the cover plate and the spring retainer plate.
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