发明授权
- 专利标题： Multifunction lead frame and integrated circuit package incorporating the same
- 专利标题（中）： 多功能引线框和集成电路封装结合在一起
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申请号： US09413605申请日： 1999-10-06
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公开(公告)号： US06351033B1公开(公告)日： 2002-02-26
- 发明人: Ashraf W. Lotfi , John D. Weld
- 申请人： Ashraf W. Lotfi , John D. Weld
- 主分类号： H05K502
- IPC分类号： H05K502
摘要：
The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.
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