发明授权
- 专利标题： System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation
- 专利标题（中）： 在固化操作之前热操作顶部和底部基底的组合的系统和方法
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申请号： US09401918申请日： 1999-09-23
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公开(公告)号： US06355129B1公开(公告)日： 2002-03-12
- 发明人: Joseph W. Paulus , Kendrick H. Light , Scott R. Parent , Donald G. Parent , Elangovan Ramanatham
- 申请人： Joseph W. Paulus , Kendrick H. Light , Scott R. Parent , Donald G. Parent , Elangovan Ramanatham
- 主分类号： G11B726
- IPC分类号： G11B726
摘要：
A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.
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