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US06355182B2 High selectivity etching process for oxides 失效
氧化物的高选择性蚀刻工艺

  • Patent Title: High selectivity etching process for oxides
  • Patent Title (中): 氧化物的高选择性蚀刻工艺
  • Application No.: US09780166
    Application Date: 2001-02-09
  • Publication No.: US06355182B2
    Publication Date: 2002-03-12
  • Inventor: Randhir ThakurJames Pan
  • Applicant: Randhir ThakurJames Pan
  • Main IPC: D44C122
  • IPC: D44C122
High selectivity etching process for oxides
Abstract:
A process for etching oxides having differing densities which is not only highly selective, but which also produces uniform etches is provided and includes the steps of providing an oxide layer on a surface of a substrate, exposing the oxide layer to a liquid comprising a halide-containing species, and exposing the oxide layer to a gas phase comprising a halide-containing species. The process desirably is used to selectively etch a substrate surface in which the surface of the substrate includes on a first portion thereof a first silicon oxide and on a second portion thereof a second silicon oxide, with the first silicon oxide being relatively more dense than the second silicon oxide, such as, for example, a process which forms a capacitor storage cell on a semiconductor substrate.
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