发明授权
- 专利标题: High frequency multi-layer module with electronic component receiving aperture and conductive via
- 专利标题(中): 具有电子元件接收孔和导电通孔的高频多层模块
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申请号: US09502184申请日: 2000-02-10
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公开(公告)号: US06359536B1公开(公告)日: 2002-03-19
- 发明人: Koichi Sakamoto , Kenichi Iio , Sadao Yamashita , Yohei Ishikawa
- 申请人: Koichi Sakamoto , Kenichi Iio , Sadao Yamashita , Yohei Ishikawa
- 优先权: JP9-95697 19970414; JP10-73871 19980323
- 主分类号: H01P100
- IPC分类号: H01P100
摘要:
An electronic module, comprising: a dielectric base plate having first and second opposing surfaces on which respective electrodes are disposed such that respective areas at the first and second surfaces are free of electrode material and aligned relative to one another to form a dielectric resonator; a first electronic component coupled to the base plate; and a first circuit sheet having first and second opposing surfaces, at least one aperture between the surfaces, and a conductor pattern disposed on the first surface, the first circuit sheet being disposed on the base plate such that: (i) the first electronic component is at least partially received within the aperture; and (ii) at least part of the conductor pattern is coupled to the dielectric resonator.
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