发明授权
- 专利标题: Ionization sputtering apparatus
- 专利标题(中): 电离溅射装置
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申请号: US09039482申请日: 1998-03-16
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公开(公告)号: US06361667B1公开(公告)日: 2002-03-26
- 发明人: Masahiko Kobayashi , Hajime Sahase , Nobuyuki Takahashi
- 申请人: Masahiko Kobayashi , Hajime Sahase , Nobuyuki Takahashi
- 优先权: JP9-085705 19970318
- 主分类号: C23C1435
- IPC分类号: C23C1435
摘要:
This invention discloses ionization sputtering apparatuses which have a function for ionizing sputtered particles. Those apparatuses comprise an ionization means for ionizing sputtered particles from a target. The ionization means generates a plasma by applying radio frequency energy with plasma generation gas at an ionization space between the target and a holder holding a substrate. An disclosed apparatus comprises a magnetic device preventing the plasma from diffusing from the ionization space. Another disclosed apparatus comprises a magnetic device which orients the ionized sputtered particles toward the substrate.
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