- 专利标题: Solder alloy composition
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申请号: US09725609申请日: 2000-11-29
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公开(公告)号: US06361742B1公开(公告)日: 2002-03-26
- 发明人: Naoko Takeda , Kazutaka Habu , Kazushi Yamauchi
- 申请人: Naoko Takeda , Kazutaka Habu , Kazushi Yamauchi
- 优先权: JPP10-270185 19980924
- 主分类号: C22C1300
- IPC分类号: C22C1300
摘要:
A lead-free solder composition having superior mechanical strength is produced by adding a rare earth element to a Sn—Ag alloy or a Sn—Ag—Bi—Cu alloy.
公开/授权文献
- US20010000321A1 Solder alloy composition 公开/授权日:2001-04-19
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