Invention Grant
US06362494B1 Semiconductor device and method and apparatus for manufacturing semiconductor device 有权
半导体装置及半导体装置的制造方法及装置

  • Patent Title: Semiconductor device and method and apparatus for manufacturing semiconductor device
  • Patent Title (中): 半导体装置及半导体装置的制造方法及装置
  • Application No.: US09294403
    Application Date: 1999-04-20
  • Publication No.: US06362494B1
    Publication Date: 2002-03-26
  • Inventor: Shigeru Yagi
  • Applicant: Shigeru Yagi
  • Priority: JP10-115265 19980424; JP10-338149 19981127
  • Main IPC: H01L3300
  • IPC: H01L3300
Semiconductor device and method and apparatus for manufacturing semiconductor device
Abstract:
Provided is a method and apparatus for the production of a semiconductor device, the method and the apparatus producing a high quality and highly functional semiconductor device efficiently at low temperatures in a short time and also a high quality and highly functional semiconductor device produced by the method and apparatus. The semiconductor device is produced by forming a film of a nitride compound on a substrate having heat resistance at 600° C. or less, wherein the nitride compound includes one or more elements selected from group IIIA elements of the periodic table and a nitrogen atom and produces photoluminescence at the band edges at room temperature. The method for producing a semiconductor device comprises introducing an organic metal compound containing one or more elements selected from group IIIA elements of the periodic table intermittently in an activated environment, while continuously activating a nitrogen compound, to form a film of a nitride compound containing nitrogen and the group IIIA elements on a substrate.
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