发明授权
US06365484B1 Method of forming semiconductor device with decoupling capacitance 失效
用去耦电容形成半导体器件的方法

  • 专利标题: Method of forming semiconductor device with decoupling capacitance
  • 专利标题(中): 用去耦电容形成半导体器件的方法
  • 申请号: US09634970
    申请日: 2000-08-09
  • 公开(公告)号: US06365484B1
    公开(公告)日: 2002-04-02
  • 发明人: Edward Joseph NowakMinh Ho Tong
  • 申请人: Edward Joseph NowakMinh Ho Tong
  • 主分类号: H01L2120
  • IPC分类号: H01L2120
Method of forming semiconductor device with decoupling capacitance
摘要:
A semiconductor device is disclosed that provides a decoupling capacitance and method for the same. The semiconductor device includes a first circuit region having a first device layer over an isolation layer and a second circuit region adjacent the first circuit region having a second device layer over a well. An implant layer is implanted beneath the isolation layer in the first circuit region, which will connect to the well of the second circuit region.
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