A double sided electrical connection flexible circuit particularly useful as a substrate for an area array integrated package, and the method of fabricating the structure is described. A circuit having interconnections on one surface and solder ball contact pads on the second surface are interconnected by copper plated from a single surface in order to avoid entrapment of air pockets. In one embodiment, the conductive vias are formed from a copper film which extends from the solder ball contact pads, which may be indented, providing a well for solder balls in the contact pad.