A heat insulation chamber according to the present invention is a heat insulation chamber which is made of heat insulating material and forms an inner chamber for accommodating an electronic part. This heat insulation chamber achieves coupling between the electronic part accommodated in the inner chamber formed within a cabinet and the outside of the cabinet by a radio transmission path or a coupling path by static coupling or inductive coupling. A thermostatic chamber and a cryostat according to the present invention comprise the aforementioned heat insulation chamber, a heat exchanger mounted in the heat insulation chamber, and a thermoregulator which maintains the temperature of the inner chamber accommodating the electronic part at an operating temperature of the electronic part through the heat exchanger. Equipments which adopt any heat insulation chambers, thermostatic chambers, or cryostats can be maintained so to have desired characteristics in a stable condition and accurately with their physical size kept from increasing greatly.