A circuit board assembly is provided for electrically coupling together two or more circuit boards, with one circuit board oriented at an acute angle relative to the other circuit board. The assembly includes a first circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes is electrically isolated from the others and each is electrically connected to electronic circuitry printed on the first circuit board. The assembly further includes a second circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes of the second board is electrically isolated from the others and is electrically connected to electronic circuitry printed on the second circuit board. The assembly also includes a conductive support plate having a plurality of connecting legs extending therefrom along a first edge thereof. The second circuit board is placed in registry with the plate, with the legs extending through the connecting holes of the second circuit board. The legs also extend through the connecting holes of the first circuit board, with the plate and the second circuit board being oriented at an angle with respect to the first circuit board. The legs are adapted to be soldered to the first circuit board and the second circuit board, and are adapted to be severed from the plate to form an electrical connection between the first circuit board and the second circuit board.