Invention Grant
- Patent Title: Rotary bonding apparatus and method
- Patent Title (中): 旋转接合装置及方法
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Application No.: US09595529Application Date: 2000-06-16
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Publication No.: US06368437B1Publication Date: 2002-04-09
- Inventor: Paul Ziegelhoffer , Bart Hardy , Michael Jarmuskiewicz , Frank Jocewicz
- Applicant: Paul Ziegelhoffer , Bart Hardy , Michael Jarmuskiewicz , Frank Jocewicz
- Main IPC: B30B1534
- IPC: B30B1534

Abstract:
A rotary bonding apparatus includes a rotatable drum and one or more bonding elements, for example, ultrasonic horn and anvil assemblies, which rotate with the drum. The drum includes a web-supporting surface, and web material which is to be bonded rotates with the drum. The web material is positioned between the bonding elements and the web and bonding elements rotate at the same velocity so that the bonding elements are stationary relative to the web being bonded.
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