发明授权
- 专利标题: Thermal processing apparatus
- 专利标题(中): 热处理设备
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申请号: US09769499申请日: 2001-01-26
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公开(公告)号: US06369361B2公开(公告)日: 2002-04-09
- 发明人: Takanori Saito , Tsuyoshi Takizawa , Kenichi Yamaga
- 申请人: Takanori Saito , Tsuyoshi Takizawa , Kenichi Yamaga
- 优先权: JP12-020149 20000128
- 主分类号: F27B514
- IPC分类号: F27B514
摘要:
A thermal processing apparatus includes a reaction vessel into which an object to be processed is conveyed, a furnace body disposed so as to surround the reaction vessel, and a heater disposed in a region surrounding the reaction vessel in the furnace body. The heater includes heating elements, each having a sealing member made of a ceramic material and a linear flexible resistance heat generating member sealed by the sealing member.
公开/授权文献
- US20010010307A1 Thermal processing apparatus 公开/授权日:2001-08-02
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