A paste of the present invention comprises a precious metal organic acid salt added to precious metal powder as a precious metal component of the conductive paste. The base metal organic acid salts are also used instead of base metal components in the inorganic binders to exclude particles with larger diameters from the conductive paste. The conductive paste of the present invention allows the lumps in the paste caused by the insufficient dispersion to be 10 &mgr;m &PHgr; or less, thereby remarkably reducing the screen blockage during screen printing of wiring pattern of 100 &mgr;m or less in width.