发明授权
- 专利标题: Composite particles for composite dispersion plating and method of plating therewith
- 专利标题(中): 用于复合分散电镀的复合颗粒及其电镀方法
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申请号: US09297393申请日: 1999-06-17
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公开(公告)号: US06372345B1公开(公告)日: 2002-04-16
- 发明人: Takayuki Wakae , Akira Tsujimura , Yuichiro Hara , Tadashi Kamimura , Masaaki Beppu , Eiji Hirai , Seiki Mori
- 申请人: Takayuki Wakae , Akira Tsujimura , Yuichiro Hara , Tadashi Kamimura , Masaaki Beppu , Eiji Hirai , Seiki Mori
- 优先权: JP9-252594 19970903
- 主分类号: B32B900
- IPC分类号: B32B900
摘要:
The present invention is applicable to composite particles for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating using such composite particles as well as a plating (coating) using the same. The purpose of the invention is to obtain a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity, and a method of plating using such composite particles. In this invention, each of the composite particles includes a friction-reducing mother or core particle (1) encapsulated with shell particles (2) comprised of the same components as a base metal of a composite dispersion plating bath (5). This provides a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity. As a result, the composite particles can form an eutectic system in a plating layer without addition of any surfactant.
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