发明授权
- 专利标题: Method for laser scanning flip-chip integrated circuits
- 专利标题(中): 激光扫描倒装芯片集成电路方法
-
申请号: US09654823申请日: 2000-09-05
-
公开(公告)号: US06375347B1公开(公告)日: 2002-04-23
- 发明人: Victoria J. Bruce , Michael R. Bruce
- 申请人: Victoria J. Bruce , Michael R. Bruce
- 主分类号: G01N2572
- IPC分类号: G01N2572
摘要:
Methods for analyzing temperature characteristics of an integrated circuit. In one embodiment, a beam of laser light is directed at the back side of an integrated circuit. The intensity level of laser light reflected from the integrated circuit is measured and compared to a reference intensity level. The magnitude of the difference between the reference intensity level and the intensity level of the reflected laser light is indicative of a temperature characteristic of the integrated circuit.
信息查询