发明授权
US06375347B1 Method for laser scanning flip-chip integrated circuits 失效
激光扫描倒装芯片集成电路方法

Method for laser scanning flip-chip integrated circuits
摘要:
Methods for analyzing temperature characteristics of an integrated circuit. In one embodiment, a beam of laser light is directed at the back side of an integrated circuit. The intensity level of laser light reflected from the integrated circuit is measured and compared to a reference intensity level. The magnitude of the difference between the reference intensity level and the intensity level of the reflected laser light is indicative of a temperature characteristic of the integrated circuit.
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