发明授权
- 专利标题： Photosensitive resin and photosensitive resin composition containing the same
- 专利标题（中）： 感光树脂和含有它们的感光性树脂组合物
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申请号： US09782256申请日： 2001-02-14
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公开(公告)号： US06376609B2公开(公告)日： 2002-04-23
- 发明人: Shigeo Nakamura , Tadahiko Yokota
- 申请人： Shigeo Nakamura , Tadahiko Yokota
- 优先权： JP6-316189 19941220
- 主分类号： G03F7028
- IPC分类号： G03F7028
摘要：
The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
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