发明授权
- 专利标题: Plating pretreatment apparatus and plating treatment apparatus
- 专利标题(中): 电镀预处理装置和电镀处理装置
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申请号: US09765742申请日: 2001-01-19
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公开(公告)号: US06383348B2公开(公告)日: 2002-05-07
- 发明人: Tetsuya Kuroda , Hidezumi Kato
- 申请人: Tetsuya Kuroda , Hidezumi Kato
- 优先权: JP2000-009598 20000119; JP2000-009599 20000119
- 主分类号: C25D1700
- IPC分类号: C25D1700
摘要:
The present invention provides a plating pretreatment apparatus that includes a cylindrical cathode disposed in a hollow portion of a fixing jig. A cylindrical object to be treated is installed on the fixing jig so that the cathode is also arranged therein. A lower portion of the cathode has a smaller diameter than an upper portion thereof. The invention also provides a plating treatment apparatus that includes an outlet jig having a hollow portion for installing a cylindrical object to be treated on a top face thereof, a cylindrical anode disposed therein so that a top end thereof projects from the top face of the outlet jig, and a plating liquid tank connected to the anode and the outlet jig. A lower portion of the anode has a smaller diameter than an upper portion thereof.
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