发明授权
US06383845B2 Stacked semiconductor device including improved lead frame arrangement
有权
堆叠的半导体器件包括改进的引线框布置
- 专利标题: Stacked semiconductor device including improved lead frame arrangement
- 专利标题(中): 堆叠的半导体器件包括改进的引线框布置
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申请号: US09854626申请日: 2001-05-15
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公开(公告)号: US06383845B2公开(公告)日: 2002-05-07
- 发明人: Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano , Yasushi Takahashi , Masayasu Kawamura
- 申请人: Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano , Yasushi Takahashi , Masayasu Kawamura
- 优先权: JP9-263434 19970929; JP10-140878 19980522
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.