A multiple line grid array package comprising a package body having a first surface and a second surface opposite to the first surface; a first pattern formed on the first surface of the package body and including a number of input/output nodes; a second pattern formed on the second surface of the package body; and a multiple line grid having a nonconductive grid body and a number of conductors formed parallel to a longitudinal axis of the nonconductive grid body on the outer peripheral portion and/or within an inner portion of the multiple line grid and bonded to the package body; wherein each of the conductors is electrically isolated from each other and matches the corresponding one of the number of input/output nodes of the first pattern. A number of such multiple line grids are arranged in a grid pattern to form the multiple line grid array.