发明授权
- 专利标题： Micro-electronic bond degradation sensor and method of manufacture
- 专利标题（中）： 微电子键降解传感器及其制造方法
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申请号： US09501798申请日： 2000-02-08
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公开(公告)号： US06384610B1公开(公告)日： 2002-05-07
- 发明人: Alan Wilson
- 申请人： Alan Wilson
- 主分类号： G01R2726
- IPC分类号： G01R2726
摘要：
A micro-electronic bond degradation sensor includes a sensor substrate having sensor circuitry and a sensor stud and a power stud extending therefrom. The sensor circuitry includes a voltage-to-current amplifier having an input coupled to sensor stud and an output coupled to the power stud. The voltage-to-current amplifier is operable to convert a voltage signal occurring along the sensor stud to a current signal output along the power stud.
信息查询
