An Integrated Optics Chip (IOC) package for an IOC, including a base having an upper support surface having a first raised surface and a dielectric gel disposed on the first raised surface of the base and adapted to couple to the IOC. The dielectric gel is sufficiently compliant to minimize stresses from structural changes in the base, accommodate a thermal mismatch between the IOC and the base, and reduce vibration. A first adhesive may be applied to a platform integral to the base that is sufficiently rigid to prevent the IOC from separating from the dielectric gel during vibration. A second adhesive may be applied on a second raised surface of the base to provide strain relief to the leads of the IOC. Advantages include the elimination of several components and manufacturing steps, improved strain relief and vibration dampening, as well as manufacturing time and cost savings.