发明授权
- 专利标题: Mold assembly
- 专利标题(中): 模具总成
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申请号: US09668640申请日: 2000-09-21
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公开(公告)号: US06386856B1公开(公告)日: 2002-05-14
- 发明人: Ming-Dong Chern , Cheng-Ju Ho
- 申请人: Ming-Dong Chern , Cheng-Ju Ho
- 主分类号: B29C6502
- IPC分类号: B29C6502
摘要:
A mold assembly has an upper positioning seat, an upper panel disposed in the upper positioning seat, a lower positioning seat, a lower panel disposed in the lower positioning seat, a first air cylinder disposed on a side of the lower positioning seat, a second air cylinder disposed on a bottom of the lower positioning seat, a third air cylinder disposed on a side of the upper positioning seat, and a fourth air cylinder disposed on a top portion of the upper positioning seat. A lower plate is disposed on a bottom of the upper panel. An upper plate is disposed on the lower panel. The lower plate engages with the upper plate.
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