发明授权
- 专利标题: Polishing apparatus
- 专利标题(中): 抛光设备
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申请号: US09397916申请日: 1999-09-17
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公开(公告)号: US06390901B1公开(公告)日: 2002-05-21
- 发明人: Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa , Hisanori Matsuo , Tetsuji Togawa , Satoshi Wakabayashi
- 申请人: Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa , Hisanori Matsuo , Tetsuji Togawa , Satoshi Wakabayashi
- 优先权: JP10-265160 19980918
- 主分类号: B24B2900
- IPC分类号: B24B2900
摘要:
An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.
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