A method for manufacturing a probe for irradiating with or detecting light is disclosed, which is possible by a batch process with high productivity, has the high process reproducibility of optical micro-apertures, facilitates integration and down sizing, enables a plurality of probes to be fabricated easily, enables fabrication on compound semiconductor substrates, does not need coupling light between a wave guide layer and an optical micro-aperture, and minimize the transmission loss of light; and a probe for irradiating with or detecting light. The method comprises the steps of: (a) forming at least one recession on a first substrate; (b) fabricating a probe structure that contains a wave guide layer on the first substrate with the above recession; (c) bonding the probe structure on a second substrate; (d) transferring the probe structure that has a protrusion onto the second substrate, by peeling the probe structure off the first substrate; and (e) forming a cantilever-type probe that has a protrusion on a free end thereof by removing a part of the second substrate.