发明授权
- 专利标题： Cooling module
- 专利标题（中）： 冷却模块
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申请号： US09318792申请日： 1999-05-26
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公开(公告)号： US06408934B1公开(公告)日： 2002-06-25
- 发明人: Yoshio Ishida , Akimi Shutou , Takao Terasaka
- 申请人： Yoshio Ishida , Akimi Shutou , Takao Terasaka
- 优先权： JP10-166297 19980528; JP10-285906 19980921; JP10-291701 19981014
- 主分类号： F28F700
- IPC分类号： F28F700
摘要：
A cooling module is disclosed which comprises a plate, a flat heat pipe, a directional motor, and a fin structure, wherein at least a part of the heat pipe is embedded into the plate while being flush with plate, and the heat pipe is disposed close to a heat generating object and a coupling portion of the fin structure.
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